Aerosol Mold Cleaner and Release

2-in-1 aerosol: cleans and re-releases in one step

Carnauba Liquid Wax Mold Release

Liquid formulation for fast, even coverage on large molds

Carnauba Wax Paste Mold Release

High-purity carnauba wax for superior gloss and hard film

Fast-Release Semi-Permanent Release Agent

Low-friction fluoropolymer for minimum demolding force and time

Food-Contact Grade Mold Release Agent

Food-contact compliant ingredients per EU 10/2011 and FDA 21 CFR

High-Temperature Release Agent (200°C Rated)

Thermally stable to 200°C for BMI and high-temp epoxy cure

Internal Mold Release (Fatty Acid Ester)

Liquid form for easy, homogeneous mixing into resin systems

Internal Mold Release (Zinc Stearate)

CAS 557-05-1

Internal release eliminates need for external mold release application

Internal Mold Release for Pultrusion

Formulated for continuous pultrusion die lubrication

Internal Mold Release for SMC/BMC

Optimized for SMC/BMC compression at 130–160°C and high pressure

Low-Silicone Semi-Permanent Release Agent

Controlled low silicone for improved release ease and higher release count

Marine Anti-Osmosis Mold Release Wax

Highly purified hydrophobic wax minimizes polar residue on part surfaces

Mold Sealer for Composite Tooling

Fills surface microporosity of new and repaired molds

New Mold Tooling Preparation Kit

Complete new mold preparation system in one kit

PVA Release Agent 10% Solution

CAS 9002-89-5

10% PVA — maximum film thickness for durability and release count

PVA Release Agent 3% Solution

CAS 9002-89-5

3% PVA for thin film release on polished, smooth molds

PVA Release Agent 5% Solution

CAS 9002-89-5

5% PVA — general-purpose production grade for open mold FRP

Polyethylene Wax Emulsion Release Agent

Water-based PE wax — no solvents, low VOC for EHS compliance

RTM Injection Resin Release Additive

Internal RTM release additive — supplements external mold release

Release Agent Gel Paste (High Build)

Thixotropic gel consistency — no sagging on vertical or inverted mold surfaces

Semi-Permanent Release (Aerospace Grade)

Aerospace-approved — full lot documentation and CoC

Semi-Permanent Release (Solvent, High Temp Tooling)

Stable to 200°C — compatible with BMI and epoxy aerospace cure cycles

Semi-Permanent Release Agent (Water-Based, GP)

Water-based formula — low VOC for workplace compliance

Semi-Permanent Release Agent (Water-Based, RTM)

Formulated for closed mold RTM injection pressure (up to 6 bar)