SEMITECH
FEP Release Film 25µm (High-Temperature Composite Mold Release)
CAS 25067-11-2In StockSample available
Key Features
- Eliminates liquid release agents
- Reusable 5-10 cycles
- Optically clear
- No transfer to part surface
Fluorinated ethylene propylene (FEP) release film for autoclave composite molding. Non-stick surface eliminates need for liquid release agents. Temperature rating to 200°C, optically clear, chemically inert.
Specifications
| Parameter | Value |
|---|---|
| Thickness | 25 µm |
| Elongation | >300% |
| Transparency | Optically clear |
| Surface Energy | < 20 mN/m |
| Temperature Rating | up to 200°C |
Applications
Carbon fiber autoclave moldingAerospace composite layupPCB lamination releaseMedical device molding
Direct Contact
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