Semi-Permanent Release (Solvent, High Temp Tooling)

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Key Features

  • Stable to 200°C — compatible with BMI and epoxy aerospace cure cycles
  • 15–30 releases per application for production efficiency
  • Solvent carrier for deep penetration into mold microstructure
  • Compatible with Invar, steel, aluminum, and epoxy composite tooling
  • High durability for high-temperature production tooling

This solvent-based semi-permanent release agent is formulated for high-temperature composite tooling and mold applications where cure temperatures exceed 100°C. The solvent-based carrier system penetrates and deposits fluoropolymer release polymers deeply into the mold surface microstructure, providing a very durable release film stable at temperatures up to 200°C. Suitable for use on epoxy tooling, Invar, steel, and aluminum molds used in aerospace prepreg autoclave cure, resin transfer molding with elevated temperature cure, and press tool operations. The release agent withstands the high-temperature cure cycles of BMI and epoxy aerospace prepregs (120–180°C). Minimum 4–6 coats for new high-temperature tooling. Drying time 5–10 min per coat. Yields 15–30 releases per application cycle on well-maintained tools. The product is flammable — use with adequate ventilation and avoid ignition sources. Not suitable for use in facilities with strict solvent-free requirements.

Specifications

ParameterValue
TypeSolvent-based semi-permanent
Shelf Life24 months
VOC ContentHigh (solvent-based)
Max. Temperature200°C
Coats (new tooling)4–6 minimum
Dry Time Between Coats5–10 min
Releases per Application15–30

Applications

Aerospace prepreg autoclave cure toolingHigh-temperature RTM molds (>120°C cure)BMI and high-temp epoxy prepreg moldsPress tools for thermosetting composite compressionInvar and CFRP tooling for aerospace

FAQ

For temperatures above 120°C, solvent-based releases generally provide better durability due to deeper penetration of the fluoropolymer into the tool surface. Water-based releases can degrade faster at elevated temperatures because the aqueous carrier leaves a more surface-level deposit. Solvent-based products are preferred in aerospace where 15–30 releases per application and maximum temperature stability are required. Where VOC and solvent regulations prohibit solvent use, water-based high-temp grades are available.

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