High-Temperature Release Agent (200°C Rated)

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Key Features

  • Thermally stable to 200°C for BMI and high-temp epoxy cure
  • High-fluorine polymer system maintains release through repeated thermal cycles
  • 15–25 releases per application on well-maintained tooling
  • Compatible with Invar, steel, aluminum, and CFRP composite tooling
  • Wipe-on/buff-off application on polished mold surfaces

This high-temperature semi-permanent release agent is engineered for composite mold applications where cure temperatures reach up to 200°C, including autoclave prepreg cure, press mold cure of high-temperature thermoset systems, and BMI (bismaleimide) resin cure cycles. Standard semi-permanent releases based on conventional fluoropolymers or wax are unstable above 150°C and will degrade, losing release function mid-cure. This product uses a thermally stable, high-fluorine-content polymer system that maintains release efficacy through repeated thermal cycles from ambient to 200°C. Compatible with BMI, high-temperature epoxy (180°C class), and cyanate ester resin systems. Apply 4–6 coats on new high-temperature tooling using the wipe-on/buff-off method. Dry time 8–12 minutes between coats. Provides 15–25 releases per application cycle on well-maintained tools. Suitable for Invar, steel, aluminum, and composite molds.

Specifications

ParameterValue
TypeHigh-fluorine semi-permanent
Shelf Life24 months
Compatible ResinsBMI, high-temp epoxy, cyanate ester
Coats (new tooling)4–6
Dry Time Between Coats8–12 min
Max. Temperature Rating200°C
Releases per Application15–25

Applications

BMI prepreg autoclave cure toolingHigh-temperature epoxy (180°C) autoclave moldsCyanate ester composite cure toolingPress cure of high-temperature thermoset systemsInvar and steel tooling for aerospace prepreg cure

FAQ

Conventional semi-permanent release agents use fluoropolymer grades that lose film integrity above 150°C — they soften, flow, and are displaced from the mold surface during the cure cycle, leaving bare mold areas. At 180–200°C (typical BMI cure), this causes adhesion of the cured part to the mold surface. High-temperature rated releases use higher molecular weight, more thermally crosslinked fluoropolymer systems that maintain their film structure and release chemistry up to 200°C.

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