High-Temperature Release Agent (200°C Rated)
Key Features
- Thermally stable to 200°C for BMI and high-temp epoxy cure
- High-fluorine polymer system maintains release through repeated thermal cycles
- 15–25 releases per application on well-maintained tooling
- Compatible with Invar, steel, aluminum, and CFRP composite tooling
- Wipe-on/buff-off application on polished mold surfaces
This high-temperature semi-permanent release agent is engineered for composite mold applications where cure temperatures reach up to 200°C, including autoclave prepreg cure, press mold cure of high-temperature thermoset systems, and BMI (bismaleimide) resin cure cycles. Standard semi-permanent releases based on conventional fluoropolymers or wax are unstable above 150°C and will degrade, losing release function mid-cure. This product uses a thermally stable, high-fluorine-content polymer system that maintains release efficacy through repeated thermal cycles from ambient to 200°C. Compatible with BMI, high-temperature epoxy (180°C class), and cyanate ester resin systems. Apply 4–6 coats on new high-temperature tooling using the wipe-on/buff-off method. Dry time 8–12 minutes between coats. Provides 15–25 releases per application cycle on well-maintained tools. Suitable for Invar, steel, aluminum, and composite molds.
Specifications
| Parameter | Value |
|---|---|
| Type | High-fluorine semi-permanent |
| Shelf Life | 24 months |
| Compatible Resins | BMI, high-temp epoxy, cyanate ester |
| Coats (new tooling) | 4–6 |
| Dry Time Between Coats | 8–12 min |
| Max. Temperature Rating | 200°C |
| Releases per Application | 15–25 |
Applications
FAQ
Conventional semi-permanent release agents use fluoropolymer grades that lose film integrity above 150°C — they soften, flow, and are displaced from the mold surface during the cure cycle, leaving bare mold areas. At 180–200°C (typical BMI cure), this causes adhesion of the cured part to the mold surface. High-temperature rated releases use higher molecular weight, more thermally crosslinked fluoropolymer systems that maintain their film structure and release chemistry up to 200°C.
Direct Contact
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