Peroxide Initiators
15 products
1,3-Bis(tert-butylperoxyisopropyl)benzene
CAS 25155-25-3
Difunctional peroxide doubles radical yield per mole for efficient crosslinking
Acetylacetone Peroxide (TBCP, Post-Cure)
CAS 37187-22-7
Milder reactivity profile than MEKP for controlled cure
Benzoyl Peroxide Granule (75%, Wetted)
CAS 94-36-0
Water wetting reduces ignition and deflagration risk vs. dry BPO
Benzoyl Peroxide Paste (50% in Plasticizer)
CAS 94-36-0
Cobalt-free cure enables production of color-stable white laminates
Benzoyl Peroxide Powder (98% Purity)
CAS 94-36-0
Highest purity BPO for precision compounding applications
Di-tert-Amyl Peroxide (DTAP)
CAS 10508-09-5
Liquid at room temperature for easy handling and metering
Dicumyl Peroxide (DCP, 98%) for SMC/BMC
CAS 80-43-3
High T½ (~116°C) provides excellent scorch resistance in SMC formulations
Lauroyl Peroxide (LPO, 98% Purity)
CAS 105-74-8
Low 10-hr T½ (~62°C) enables cure at 50–80°C processing temperatures
MEKP (Methyl Ethyl Ketone Peroxide, 33% Active)
CAS 1338-23-4
Industry-standard reactivity for consistent gel and cure profiles
MEKP Cobalt-Free System (Amine Accelerated)
CAS 1338-23-4
Completely cobalt-free for REACH compliance
MEKP Premium (Low Cobalt Optimized)
CAS 1338-23-4
Optimized for low cobalt cure systems, reducing discoloration risk
MEKP Reduced VOC Formulation
CAS 1338-23-4
VOC content <50 g/L, meeting strict emission regulations
Peroxide Blend for Fast Cure (5-8 min gel)
CAS 1338-23-4
Pre-formulated for 5-8 minute gel times at standard cobalt levels
tert-Butyl Peroxy-2-Ethylhexanoate (TBPEH)
CAS 3006-82-4
Mid-range T½ (~73°C) ideal for pultrusion and warm-cure RTM
tert-Butyl Peroxybenzoate (TBPB, 98%)
CAS 614-45-9
Ideal 10-hr T½ (~100°C) for SMC/BMC press molding at 140–165°C