Amine Curing Agents

2,4,6-Tris(dimethylaminomethyl)phenol (DMP-30)

CAS 90-72-2

Triple tertiary amine functionality for high catalytic activity

4,4'-Diaminodiphenylmethane (DDM/MDA)

CAS 101-77-9

High aromatic Tg (140–160°C) for structural and aerospace applications

4,4'-Diaminodiphenylsulfone (DDS)

CAS 80-08-0

Latent hardener — excellent out-time and prepreg shelf life

4,4'-Methylenebiscyclohexylamine (PACM)

CAS 1761-71-3

Near water-white color with exceptional UV stability for clear systems

Benzyl Dimethylamine (BDMA, Accelerator)

CAS 103-83-3

Powerful accelerator for anhydride and latent epoxy systems

Cold Cure Amine System (5°C Cure)

Complete cure at 5°C with acceptable mechanical properties

Cycloaliphatic Amine Blend (Fast Cure)

UV-resistant cycloaliphatic chemistry with faster cure than pure IPDA/PACM

Diethylenetriamine (DETA)

CAS 111-40-0

Highly reactive — enables room-temperature cure with short pot life

Fast 5-Minute Epoxy Amine Hardener

Ultra-fast 4-6 minute gel time for rapid repair and assembly

Isophorone Diamine (IPDA)

CAS 2855-13-2

Outstanding UV and weathering resistance — minimizes yellowing

Ketimine Latent Amine (Moisture-Cure)

Moisture-activated — enables 1-component epoxy formulations

Mannich Base Amine Hardener

Very high reactivity — enables cure down to -5°C

Modified Aliphatic Amine Adduct (Low Blush)

Low blush formulation — maintains surface quality in humid conditions

Modified Cycloaliphatic Amine (Anchor 1040 Type)

Fast gel time (20–40 min at 25°C) for production laminating

Phenalkamine Hardener (Cashew-Based)

Cures at 0°C and even under water due to hydrophobic phenolic backbone

Polyamide Hardener (Amine Value 115)

Excellent flexibility and peel strength in flexible bond lines

Polyamide Hardener (Amine Value 140)

Higher reactivity than AV 115 for faster production throughput

Tetraethylenepentamine (TEPA)

CAS 112-57-2

Highest amine functionality in the ethyleneamine series for dense networks

Triethylenetetramine (TETA)

CAS 112-24-3

Slightly lower reactivity than DETA for longer pot life in large castings

Waterborne Epoxy Amine Adduct

Water-dispersible for low-VOC 2K epoxy formulations