Dicumyl Peroxide (DCP, 98%) for SMC/BMC

Dicumyl Peroxide (DCP) at 98% purity is a high-temperature dialkyl peroxide with a 10-hour half-life temperature of approximately 116°C. It is widely used as a crosslinking and cure initiator in SMC (Sheet Moulding Compound), BMC (Bulk Moulding Compound), and polyethylene (PE) crosslinking applications at press temperatures of 150–180°C. DCP generates cumyloxy radicals and, upon beta-scission, methyl radicals and acetophenone. In SMC applications, DCP provides a controlled, slow exotherm that benefits thick or complex-shaped parts where rapid heat buildup could cause surface defects or voids. The high decomposition temperature (relative to TBPB) means DCP provides good scorch resistance — the SMC compound retains its flow characteristics until the press reaches full temperature. DCP is typically used at 0.5–1.5% on resin in SMC formulations, often in combination with a faster-acting co-initiator for thin-walled parts. The white crystalline solid requires melt dispersion into hot resin or dissolution in a carrier solvent for uniform incorporation into SMC paste.