tert-Butyl Peroxy-2-Ethylhexanoate (TBPEH)

CAS 3006-82-4In StockSample available

Key Features

  • Mid-range T½ (~73°C) ideal for pultrusion and warm-cure RTM
  • Excellent cure uniformity in pultruded FRP profiles
  • Liquid form for precise metering in automated resin mixing
  • Compatible with both UPR and vinyl ester resin systems
  • Suitable as primary or co-initiator in dual-peak cure formulations

tert-Butyl Peroxy-2-Ethylhexanoate (TBPEH), commonly known by trade names such as Trigonox 21, is a medium-temperature organic peroxide with a 10-hour half-life temperature of approximately 73°C. It is one of the most widely used initiators for warm cure and elevated temperature cure of unsaturated polyester and vinyl ester resins in the range of 80–130°C. TBPEH is particularly valued in pultrusion processes where consistent, controlled exotherm at die temperatures of 100–150°C is essential for high-quality profiles. It is also used in filament winding systems where parts undergo post-cure in an oven, and in RTM/VARTM processes that incorporate a staged warm cure cycle to achieve full crosslink density. The liquid form (clear, slightly yellow) makes it straightforward to meter and blend into resin systems. TBPEH can be combined with a high-temperature peroxide (TBPB) for dual-peak cure profiles in thick SMC sections. Typical dosage is 0.5–1.5% on resin for pultrusion and warm-cure applications. Store at or below 10°C to ensure shelf life integrity.

Specifications

ParameterValue
AppearanceClear colorless to pale yellow liquid
Shelf Life12 months at ≤10°C
TBPEH Purity≥97%
Density (20°C)0.89–0.91 g/cm³
Active Oxygen Content≥7.3%
10-hr Half-Life Temperature~73°C

Applications

Pultrusion of FRP profiles at 100–150°C die temperaturesFilament winding with oven post-cure at 80–120°CWarm-cure RTM and VARTM processesDual-peak cure in SMC thick sections (combined with TBPB)Continuous lamination processes at 80–100°C

FAQ

TBPEH is most effective at die temperatures between 110–145°C. At this range, its half-life is reduced to seconds to minutes, providing rapid cure as the resin enters the heated die zone. The die temperature profile typically has a peak at 130–140°C. If the die temperature is lower than 90°C, TBPEH alone may not achieve full cure, and a lower T½ peroxide or dual-initiator system should be considered.

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