Cold Cure Amine System (5°C Cure)

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Key Features

  • Complete cure at 5°C with acceptable mechanical properties
  • Low viscosity maintained at low temperature for good wet-out
  • Fast tack-free time (8-16 hours at 5°C) for practical construction schedules
  • Compatible with standard BPA epoxy resins
  • Essential for winter construction and cold-climate offshore use

Cold Cure Amine System is a specially formulated epoxy hardener designed to achieve complete, high-quality cure at temperatures as low as 5°C — a critical requirement for winter construction, offshore marine applications, and cold-climate composite fabrication. Standard amine hardeners (DETA, TETA, IPDA) lose reactivity rapidly below 10°C and may produce incomplete cure, poor mechanical properties, and high residual monomer content at low temperatures. This cold-cure formulation combines accelerated aliphatic or cycloaliphatic amines with reactive diluents and phenolic accelerators to maintain sufficient reactivity at 5°C, achieving practical tack-free time of 8–16 hours and full cure within 7 days at 5°C. Mechanical properties and chemical resistance at 5°C cure are comparable to standard-grade systems cured at 20°C, with only modest reductions in final Tg. Mix ratio with standard BPA epoxy is approximately 25–35 phr. This product is essential for offshore platform maintenance, cold-storage facility floor coatings, winter bridge deck repair, and field composite lamination in cold climates.

Specifications

ParameterValue
TypeAccelerated modified amine cold-cure system
Shelf Life12 months in sealed container
Viscosity (10°C)<500 mPa·s
Tack-Free Time (5°C)8–16 hours
Minimum Cure Temperature5°C
Mix Ratio (phr on BPA epoxy)25–35 phr

Applications

Winter construction epoxy coatings and civil engineering repairsOffshore platform maintenance at low ambient temperaturesCold-storage facility epoxy floor coatingsField composite repair in cold-climate environmentsWinter-grade marine epoxy laminating systems

FAQ

This system is designed for reliable cure at temperatures down to 5°C. At 0°C, cure is possible but very slow (tack-free time >24 hours, full cure >14 days) and final properties may be compromised. Below 0°C, thermal cure is not practical without substrate or ambient heating. For sub-zero applications, consider thermal blankets or heating mats to raise the substrate temperature above 5°C before and during cure.

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