Waterborne Epoxy Amine Adduct
Key Features
- Water-dispersible for low-VOC 2K epoxy formulations
- Enables <100 g/L VOC coatings meeting REACH and EU Directive
- Good corrosion and chemical resistance in cured films
- Compatible with waterborne BPA epoxy dispersions
- Reduces occupational solvent exposure in coating operations
Waterborne Epoxy Amine Adduct is a specially modified polyamine adduct designed for use in water-dispersible or water-reducible two-component epoxy coating systems. It is produced by reacting a polyamine backbone with a combination of epoxy diluents and emulsification groups, allowing the hardener to self-disperse in water or reduce with water to form stable, low-VOC epoxy/hardener emulsions. This technology enables the formulation of waterborne 2K epoxy coatings for floor coatings, marine primers, civil engineering applications, and composite surface treatments with very low VOC content — typically <100 g/L — meeting the most stringent environmental and occupational health regulations. The adduct is supplied as a water-reducible liquid with an amine value of 200–400 mg KOH/g, designed for mixing with a waterborne BPA epoxy dispersion at approximately 1:1 to 1:2 weight ratios. Cured films exhibit good corrosion resistance, chemical resistance, and adhesion comparable to solvent-borne counterparts. Film performance is somewhat humidity-sensitive during application and initial cure stages, requiring relative humidity below 80% for best results.
Specifications
| Parameter | Value |
|---|---|
| Type | Water-dispersible amine adduct |
| Appearance | Opaque white to cream liquid |
| Shelf Life | 12 months in sealed container |
| Amine Value | 200–400 mg KOH/g |
| VOC Content | <100 g/L |
| Solid Content | 50–70% |
Applications
FAQ
Waterborne amine adducts are modified with hydrophilic segments or emulsifying groups that allow them to disperse in water without phase separation. This requires additional formulation work to balance dispersion stability, pot life, and film formation. Water must evaporate during cure, requiring adequate airflow and temperature. Film properties are generally similar to solventborne systems but can be more humidity-sensitive during application.
Direct Contact
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