Uron-Accelerated DICY System (1-Component)

CAS 461-58-5In StockSample available

Key Features

  • Lower activation temperature than standard DICY — cures at 100–130°C vs. 140–160°C
  • Excellent ambient latency (3–12 months) for stable 1K prepreg and adhesive systems
  • Pre-blended format simplifies handling and reduces dosage error in production
  • Achieves Tg 110–140°C with high ILSS and fatigue resistance after cure
  • Compatible with accelerated cure in 20–60 min cycles without imidazole addition

Uron-Accelerated DICY Systems are pre-blended one-component latent epoxy hardener formulations combining fine-grade Dicyandiamide (DICY) with a uron-type accelerator — typically a substituted urea derivative such as DCMU (3-(3,4-dichlorophenyl)-1,1-dimethylurea), fenuron, or isophorone-bis-urea — to achieve faster cure initiation at reduced temperatures compared to standard DICY alone. The uron accelerator decomposes thermally above 80–100°C to release an isocyanate fragment and a dimethylamine, which then catalyzes DICY dissolution and reaction with epoxy. This thermally-triggered release mechanism preserves excellent ambient latency (3–12 months in liquid epoxy at 25°C) while enabling cure cycles at 100–130°C — significantly lower than unacc­elerated DICY (which requires 140–160°C). Uron-DICY systems are the preferred one-component hardener for structural epoxy prepregs, automotive 1K adhesive films, and industrial thermosetting coatings where processing temperatures must be kept below 130°C. Typical total system dosage is 5–9 phr (combined DICY + uron accelerator) on standard BPA epoxy (EEW 190). Fully cured systems achieve Tg of 110–140°C with excellent interlaminar shear strength (ILSS) and fatigue resistance. The pre-blended format eliminates separate weighing of two low-phr components, reducing formulation error in high-volume production.

Specifications

ParameterValue
AppearanceWhite to off-white fine powder
DICY Content70–80 wt% of total blend
Cure Schedule30–60 min at 120°C, or 20–40 min at 130°C
Recommended Dosage5–9 phr on BPA epoxy (EEW 190)
Particle Size (d50)≤10 µm (co-milled blend)
Shelf Life (in epoxy)3–12 months at 25°C; 12–24 months at 0°C
Uron Accelerator Content20–30 wt% of total blend

Applications

Structural epoxy prepreg for automotive 1K adhesive films (100–130°C cure)Wind blade spar cap prepreg systems requiring sub-130°C cure temperaturesOne-component epoxy structural adhesive films with 6+ month ambient shelf lifeIndustrial epoxy thermosetting coatings and powder coatings (fast cure cycle)B-staged epoxy glass laminate and PCB prepreg (FR4 manufacturing)

FAQ

Standard DICY requires temperatures above 140°C to dissolve into epoxy melt and begin reacting. Uron-type accelerators (substituted ureas like DCMU) decompose exothermically above 80–100°C, releasing dimethylamine (DMA) in situ. This DMA acts as a tertiary amine catalyst that dramatically accelerates DICY dissolution and the DICY-epoxy ring-opening reaction, effectively lowering the onset cure temperature to 100–110°C. The key advantage is that the uron remains chemically inert at ambient temperature (unlike pre-dissolved liquid amines), so it does not compromise latency below 80°C.

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