Key Features
- Excellent latency — 3-12 months shelf life at ambient in epoxy systems
- Standard latent curative for aerospace prepreg and automotive 1K adhesives
- Fine particle grade ensures uniform dispersion in liquid epoxy
- High Tg (120–160°C) and outstanding mechanical properties after cure
- Used with accelerators (imidazoles, urons) for practical cure times
Dicyandiamide (DICY), also known as cyanoguanidine, is the most widely used latent epoxy curing agent for one-component prepreg, adhesive film, and structural adhesive systems in aerospace, automotive, and wind energy composite manufacturing. In fine grade form (d50 ≤ 5 µm), DICY disperses uniformly in liquid epoxy resin systems at room temperature without dissolving significantly, providing excellent latency — systems remain reactive but stable for 3–12 months at ambient temperature or 6–18 months at 0°C. When heated above 120–150°C, DICY dissolves into the epoxy melt and reacts as a bifunctional curative (guanidine groups react with epoxy rings), producing fully crosslinked networks with high Tg (120–160°C) and outstanding mechanical properties. DICY-cured epoxy exhibits exceptional fatigue resistance, impact toughness, and chemical resistance, making it the preferred hardener for aerospace CFRP prepreg, automotive structural adhesives, and wind blade spar cap laminates. Typical dosage is 4–7 phr on standard BPA epoxy (EEW 190), always used in combination with an accelerator (2-MI, EMI-24, or uron-type) to achieve practical cure times at 120–180°C.
Specifications
| Parameter | Value |
|---|---|
| Purity | ≥99% |
| Appearance | White fine powder |
| Shelf Life | 24 months at ≤25°C |
| Melting Point | 208–212°C (decomposes) |
| Typical Dosage | 4–7 phr on BPA epoxy |
| Particle Size (d50) | ≤5 µm (fine grade) |
Applications
FAQ
Fine DICY (d50 ≤5 µm) disperses homogeneously in liquid epoxy without significant dissolution, maintaining physical latency. Coarse DICY (d50 20–40 µm) can lead to non-uniform hardener distribution in thin prepreg layers, causing variations in cure degree across the laminate. In prepreg, where layer thickness may be 100–250 µm, fine DICY is critical for uniform property development.
Direct Contact
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