2-Methylimidazole (2-MI)

CAS 693-98-1In StockSample available

Key Features

  • Latent at ambient temperature — no cure activity until heated
  • Excellent catalyst efficiency above 100°C (very low dose required)
  • Solid form for safe handling — low vapor pressure vs. liquid amines
  • Synergistic with DICY for one-component epoxy systems
  • Industry standard for FR4 PCB and powder coating applications

2-Methylimidazole (2-MI) is a solid imidazole accelerator and latent curing catalyst for epoxy resin systems, providing delayed activation at ambient temperature but excellent cure efficiency above 100°C. Imidazoles are recognized as among the most efficient epoxy accelerators, generating a single imidazole molecule capable of catalyzing thousands of epoxy ring-opening events through a chain-growth anionic mechanism before being quenched. 2-MI is widely used in epoxy powder coatings, B-staged prepreg systems, DICY-based one-component epoxy adhesives, and printed circuit board laminate (FR4/G10) formulations where latency (no reaction at ambient) combined with fast cure at 150–180°C is required. At typical loadings of 0.5–3 phr on epoxy resin, 2-MI provides a latent system stable at room temperature for weeks to months and capable of achieving full cure in 15–30 minutes at 150–180°C. 2-MI is a white solid with low vapor pressure, providing safer handling than liquid tertiary amines. It acts in synergy with DICY in one-component epoxy systems.

Specifications

ParameterValue
Purity≥98%
AppearanceWhite to off-white crystalline powder
Shelf Life24 months in sealed container
Melting Point142–147°C
Typical Loading0.5–3 phr on epoxy
Activation Temperature>100°C

Applications

Accelerator in DICY-based one-component epoxy adhesives and prepregsEpoxy powder coating cure catalystFR4/G10 PCB laminate epoxy acceleratorB-staged epoxy film adhesive and prepreg systemsLatent accelerator in SMC compression molding epoxy compounds

FAQ

2-MI is a solid with a melting point of 142–147°C and limited dissolution in liquid epoxies at ambient temperature. At room temperature, its ring nitrogen is relatively inactive toward epoxy ring opening. Above 100°C, 2-MI dissolves into the epoxy melt and the imidazole's nucleophilic nitrogen becomes active, initiating anionic polymerization. The combination of physical latency (low dissolution at ambient) and thermal activation gives 2-MI an effective latency at room temperature.

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