2-Ethyl-4-Methylimidazole (EMI-24)

CAS 931-36-2In StockSample available

Key Features

  • More reactive at lower temperatures than 2-MI for 80-120°C cure
  • Liquid above 45°C for easy metering in warm processing
  • Good balance of room-temperature latency and moderate-temp activity
  • Compatible with DICY, anhydride, and standalone epoxy cure
  • Available in microencapsulated form for enhanced latency

2-Ethyl-4-Methylimidazole (EMI-24, also known as 2E4MI) is a liquid or low-melting-point imidazole accelerator for epoxy resin systems, offering higher ambient-temperature reactivity than 2-MI while maintaining good latency at room temperature. EMI-24's melting point of approximately 40–45°C means it is liquid at typical warm processing temperatures (40–60°C) and provides meaningful acceleration in epoxy systems at temperatures above 80°C. It is more soluble in liquid epoxy resins at room temperature than 2-MI, resulting in faster cure at lower temperatures (80–120°C), making it preferred for applications requiring moderate cure temperatures without full-temperature post-cure. EMI-24 is a widely used accelerator for DICY-based one-component epoxy adhesives, powder coatings, composites, and filament winding systems where cure at 80–120°C is practical. Dosage is typically 0.3–2 phr on epoxy resin, providing room-temperature shelf life of 2–6 months and cure in 30–60 minutes at 120°C. EMI-24 is also used as a standalone catalyst for epoxy homopolymerization at elevated temperature. It is available as a neat liquid (above 45°C), as solution in epoxy resin, or as microencapsulated grades for enhanced latency.

Specifications

ParameterValue
Purity≥98%
AppearancePale yellow solid or liquid (above 45°C)
Shelf Life24 months in sealed container
Melting Point40–45°C
Typical Loading0.3–2 phr on epoxy
Activation Temperature>80°C

Applications

DICY-accelerated one-component epoxy adhesives and prepregsEpoxy powder coating cure acceleration at 150–180°CFilament winding epoxy systems cured at 80–120°CAccelerator in epoxy encapsulant and potting compoundsCo-accelerator in MTHPA/epoxy electrical casting systems

FAQ

2-MI (melting point 142°C) is highly latent at ambient — the solid dissolves slowly in liquid epoxy at 25°C, giving 6–12+ months shelf life in B-staged prepregs. EMI-24 (melting point 40–45°C) is more soluble at ambient, giving 2–4 months shelf life. EMI-24 cures faster at lower temperatures (80–100°C), while 2-MI typically requires 120–150°C for practical cure times. Choose 2-MI for maximum latency/shelf life, EMI-24 for faster lower-temperature cure.

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