Sandwich Structures

Automotive SMC UPR

CAS 26455-61-8

Precise MgO thickening profile for 3-5 day SMC maturation

BMI Aerospace Prepreg System (177°C Processable, 230°C Post-Cure)

CAS 13676-54-5

Processable in standard 177°C autoclave infrastructure

Bismaleimide Resin Powder (4,4'-BMI, High-Temperature Monomer)

CAS 13676-54-5

Tg 280-320°C — highest Tg in processable addition thermoset family

Bismaleimide Resin Solution (BMI/DDM in MEK, Prepreg Grade)

CAS 13676-54-5

Pre-blended BMI/DDM at precise ratio — eliminates customer mixing error

1-Part Heat-Cure Epoxy Film Adhesive

One-component — no mixing, no mess, precise bond line control

1-Part Moisture-Cure PU Adhesive

Single component — no mixing required

2-Part Epoxy Structural Adhesive (5 min cure)

5-minute work time and fixture for rapid production cycles

2-Part Epoxy Structural Adhesive (60 min work time)

60-minute open time for large and complex assemblies