End-Use Application
Repair & Maintenance
Repair resins, putties, and patching systems for composite structure rehabilitation and field repair.
Product Categories
Featured Resins
View allAutomotive SMC UPR
CAS 26455-61-8
Precise MgO thickening profile for 3-5 day SMC maturation
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BMI Aerospace Prepreg System (177°C Processable, 230°C Post-Cure)
CAS 13676-54-5
Processable in standard 177°C autoclave infrastructure
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Bismaleimide Resin Powder (4,4'-BMI, High-Temperature Monomer)
CAS 13676-54-5
Tg 280-320°C — highest Tg in processable addition thermoset family
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Bismaleimide Resin Solution (BMI/DDM in MEK, Prepreg Grade)
CAS 13676-54-5
Pre-blended BMI/DDM at precise ratio — eliminates customer mixing error
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Featured Structural Adhesives
View all1-Part Heat-Cure Epoxy Film Adhesive
One-component — no mixing, no mess, precise bond line control
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1-Part Moisture-Cure PU Adhesive
Single component — no mixing required
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2-Part Epoxy Structural Adhesive (5 min cure)
5-minute work time and fixture for rapid production cycles
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2-Part Epoxy Structural Adhesive (60 min work time)
60-minute open time for large and complex assemblies
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