Bisphenol F Low Viscosity Epoxy (EEW 158-168)

Bisphenol F Low Viscosity Epoxy (EEW 158-168 g/eq) is a premium-purity BPF epoxy produced with strict control of the monomer isomer ratio and minimal high-molecular-weight oligomers to achieve the lowest possible viscosity (1,500-3,000 mPa·s at 25°C) in the bisphenol-based liquid epoxy category. This grade achieves viscosity targets not attainable with standard BPF grades due to tighter molecular weight distribution.

The ultra-low viscosity enables use as the base resin in high-performance infusion epoxy systems and advanced composite laminating without reactive diluents, preserving the full chemical resistance and thermal performance of the BPF backbone. Hydrolyzable chloride ≤300 ppm and Gardner color ≤1 make it suitable for semiconductor encapsulation and optical applications.

With DDS (4,4'-diaminodiphenylsulfone) curing at 180°C/2h, Tg exceeds 180°C with excellent hot/wet mechanical property retention. This makes it a key component in aerospace structural composite systems where maximum Tg with manageable viscosity is required. Applications include aerospace prepreg resin systems, high-temperature composite tooling, advanced adhesive formulations, and semiconductor encapsulation.