Bisphenol F Liquid Epoxy Resin (EEW 155-170)

Bisphenol F Liquid Epoxy Resin (EEW 155-170 g/eq) is produced by the condensation of bisphenol F (4,4'-dihydroxydiphenylmethane) with epichlorohydrin. Compared to bisphenol A epoxy (EEW 184-194), bisphenol F epoxy has a significantly lower viscosity (2,000-4,500 mPa·s at 25°C) due to the lack of geminal methyl groups on the central carbon, resulting in a less symmetric, more flexible backbone that crystallizes less readily at low temperatures.

The lower viscosity of BPF epoxy makes it the preferred choice for low-temperature applications, high-solids coating formulations, solventless systems, and neat resin casting where BPA epoxy would be too viscous. EEW of 155-170 g/eq (higher epoxy content than BPA) enables slightly lower curing agent dosages and potentially higher cross-link density.

Cured BPF epoxy with aromatic amines (DDS, DDM) provides Tg 150-175°C and chemical resistance equivalent to or slightly superior to BPA epoxy. In composite applications, BPF epoxy is used as a reactive diluent for BPA epoxy blends to reduce viscosity without introducing non-reactive species. Electrical encapsulation and transformer casting grades are a major application area for BPF due to its excellent electrical properties and low viscosity at processing temperatures.