Bisphenol A Liquid Epoxy Resin (EEW 184-194)

Bisphenol A Liquid Epoxy Resin (EEW 184-194 g/eq) is the industry-standard general purpose epoxy resin, produced by the controlled condensation of bisphenol A with epichlorohydrin to a degree of polymerization (n≈0.13) that maintains liquid state at ambient temperature. This grade is equivalent to common industry designations Epon 828, DER 331, Araldite GY 250, and Epikote 828.

With an epoxy equivalent weight of 184-194 g/eq, viscosity of 11,000-15,000 mPa·s at 25°C, and color ≤Gardner 2, this resin is the workhorse for composite structural lamination, adhesives, coatings, and electrical encapsulation. The high purity (hydrolyzable chloride ≤500 ppm, total chloride ≤1,500 ppm) ensures excellent cured properties and compatibility with all standard curing agents including amines, anhydrides, mercaptans, and catalytic curatives.

Cured with stoichiometric aromatic amines (DDM, DDS), this resin achieves Tg of 150-180°C and excellent mechanical properties. With aliphatic amines (DETA, TETA), ambient temperature cure is rapid with Tg of 60-100°C. Applications span aerospace composite prepregs, structural adhesives, marine and construction coatings, and electrical laminates (FR4/CEM circuit boards).