High Temperature Epoxy Adhesive (>200°C)
Key Features
- Tg >200°C for structural bonding at elevated temperature service
- High RT lap shear strength (≥25 MPa)
- Retains >40% strength at 200°C
- Excellent resistance to aviation fuels, hydraulic fluids, solvents
- Thermal cycle stability -55°C to +200°C
This high temperature epoxy structural adhesive is formulated with a multifunctional epoxy resin base and aromatic diamine curing agent to achieve a glass transition temperature (Tg) exceeding 200°C after a suitable post-cure cycle. Designed for bonding composite structures that must operate at elevated temperatures including aerospace engine nacelles, exhaust duct assemblies, automotive underhood components, and industrial process equipment. The 2-component paste is mixed at 100:30 pbw (resin:hardener) and staged through a multi-step cure: initial gel at 80°C/2 h, final cure at 160–200°C/2 h, achieving Tg >200°C (DSC). Tensile shear strength at 200°C exceeds 10 MPa (dry). Lap shear strength at room temperature exceeds 25 MPa. The product maintains adhesive integrity under thermal cycling between -55°C and +200°C. Chemical resistance to aviation fuels, hydraulic fluids, and industrial solvents is excellent post-cure.
Specifications
| Parameter | Value |
|---|---|
| Cure Schedule | 80°C/2 h + 160–200°C/2 h |
| Mix Ratio (pbw) | 100:30 (Resin:Hardener) |
| Thermal Cycling | -55°C to +200°C |
| Service Temperature | Up to +220°C (short term) |
| Tg (DSC, post-cure) | > 200°C |
| Lap Shear Strength (RT) | ≥ 25 MPa |
| Lap Shear Strength (200°C) | ≥ 10 MPa |
Applications
FAQ
For maximum Tg >200°C, yes. Curing only at 80°C produces a partially cured network with Tg of approximately 100–120°C, which is insufficient for high-temperature service. The second high-temperature post-cure step drives the reaction to completion, achieving full network formation and the target Tg. For applications requiring only Tg >150°C, the cure can stop at 160°C/2 h.
Direct Contact
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