High Temperature Epoxy Adhesive (>200°C)

In StockSample available

Key Features

  • Tg >200°C for structural bonding at elevated temperature service
  • High RT lap shear strength (≥25 MPa)
  • Retains >40% strength at 200°C
  • Excellent resistance to aviation fuels, hydraulic fluids, solvents
  • Thermal cycle stability -55°C to +200°C

This high temperature epoxy structural adhesive is formulated with a multifunctional epoxy resin base and aromatic diamine curing agent to achieve a glass transition temperature (Tg) exceeding 200°C after a suitable post-cure cycle. Designed for bonding composite structures that must operate at elevated temperatures including aerospace engine nacelles, exhaust duct assemblies, automotive underhood components, and industrial process equipment. The 2-component paste is mixed at 100:30 pbw (resin:hardener) and staged through a multi-step cure: initial gel at 80°C/2 h, final cure at 160–200°C/2 h, achieving Tg >200°C (DSC). Tensile shear strength at 200°C exceeds 10 MPa (dry). Lap shear strength at room temperature exceeds 25 MPa. The product maintains adhesive integrity under thermal cycling between -55°C and +200°C. Chemical resistance to aviation fuels, hydraulic fluids, and industrial solvents is excellent post-cure.

Specifications

ParameterValue
Cure Schedule80°C/2 h + 160–200°C/2 h
Mix Ratio (pbw)100:30 (Resin:Hardener)
Thermal Cycling-55°C to +200°C
Service TemperatureUp to +220°C (short term)
Tg (DSC, post-cure)> 200°C
Lap Shear Strength (RT)≥ 25 MPa
Lap Shear Strength (200°C)≥ 10 MPa

Applications

Aerospace nacelle and engine composite bondingAutomotive exhaust and underhood structuresIndustrial process equipment at elevated temperatureComposite repair in high-temperature serviceMilitary aerospace structural bonding

FAQ

For maximum Tg >200°C, yes. Curing only at 80°C produces a partially cured network with Tg of approximately 100–120°C, which is insufficient for high-temperature service. The second high-temperature post-cure step drives the reaction to completion, achieving full network formation and the target Tg. For applications requiring only Tg >150°C, the cure can stop at 160°C/2 h.

Request a Quote

Related Products