BMI Film Adhesive (Aerospace Grade)
Key Features
- Tg >230°C for high-temperature aerospace service
- Retains ≥48% shear strength at 200°C
- Thermoplastic-toughened for improved peel and impact
- 30-day out-life for workshop flexibility
- Compatible with BMI and high-temperature epoxy composite systems
This bismaleimide (BMI) film adhesive is formulated for structural bonding in aerospace applications requiring service temperatures above the capability of standard epoxy adhesives. Cured Tg exceeds 230°C (DMA) with service temperature to 220°C continuous, 230°C short-term. Tensile shear strength at room temperature exceeds 25 MPa, and at 200°C dry exceeds 12 MPa — significantly better retained hot-wet strength than epoxy film adhesives. Film weight 180–250 g/m². Cure at 175–180°C/2 h + post-cure at 230°C/2 h for full property development. Stored at -18°C with 30-day out-life at room temperature. Used for co-bonding and secondary bonding of BMI and high-temperature epoxy composites in aircraft engine nacelles, hot structures, and fire-zone composite components. Peel strength and toughness are enhanced by the addition of thermoplastic toughening agents.
Specifications
| Parameter | Value |
|---|---|
| Tg (DMA) | > 230°C |
| Resin Base | Bismaleimide (BMI) |
| Film Weight | 180–250 g/m² |
| Cure Schedule | 175–180°C/2 h + 230°C/2 h post-cure |
| Out-Life (23°C) | 30 days |
| Tensile Shear (RT) | ≥ 25 MPa |
| Tensile Shear (200°C dry) | ≥ 12 MPa |
Applications
FAQ
BMI film adhesive provides a higher Tg (>230°C vs 180–200°C for best epoxy films) and better strength retention at 200°C+. For hot structures in aircraft engines, exhaust areas, and environments above 180°C, only BMI or polyimide adhesives provide adequate structural retention. Epoxy film adhesives are preferred for temperatures up to 180°C due to lower cost and easier processing; BMI is required above 180°C.
Direct Contact
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