Epoxy Novolac Resin F-44 (High Temperature)
Key Features
- Highest Tg (180-220°C) in the epoxy novolac family
- Functionality 4.0-5.5 for maximum cross-link density
- Standard component in aerospace BMI/epoxy hybrid systems
- Excellent hot/wet property retention
- Power semiconductor encapsulation grade available
Epoxy Phenol Novolac Resin F-44 is a high-functionality epoxy derived from phenol-formaldehyde novolac with average functionality of 4.0-5.5 epoxide groups per molecule and EEW of 195-220 g/eq. The higher functionality versus F-51 and longer novolac backbone produce a resin system capable of achieving Tg values of 180-220°C, making it the premium epoxy novolac for extreme high-temperature structural composites, high-HDT electrical laminates, and high-temperature chemical process FRP.
F-44 is characterized by a semi-solid to solid consistency at ambient temperature (softening point 65-95°C) and is typically processed as a solution in solvents (MEK, DMF) or in blended systems with reactive diluents. The resin reacts with all standard epoxy curing agents (aromatic amines, anhydrides, DICY) and provides excellent chemical resistance in the cured state.
In aerospace composite applications, F-44 is the standard high-performance novolac component in BMI/epoxy hybrid systems and high-temperature prepreg formulations for jet engine nacelle structures, turbine blade shrouds, and other components requiring structural integrity above 200°C. The resin also serves as the basis for electronics-grade encapsulants for power semiconductors operating at junction temperatures above 150°C.
Specifications
| Parameter | Value |
|---|---|
| Appearance | Amber semi-solid to solid |
| Processing Form | Solution in MEK/DMF or solid flakes |
| Softening Point | 65-95°C |
| Average Functionality | 4.0-5.5 |
| Hydrolyzable Chloride | ≤500 ppm |
| Epoxy Equivalent Weight | 195-220 g/eq |
| Tg (DDS cured, 180°C+) | 180-220°C |
Applications
FAQ
Maximum Tg is achieved with 4,4'-DDS (diaminodiphenylsulfone): stoichiometric ratio 68-72 phr per 100g F-44 (using AHEW 62 g/eq, EEW ~207 midpoint). Cure schedule: 120°C/2h + 177°C/2h + 200°C/2h staged cure. This achieves Tg 200-220°C. For moderate Tg (170-185°C), DDM (4,4'-diaminodiphenylmethane) at 33-37 phr with 150°C/2h + 180°C/2h cure is simpler and more economical.
Direct Contact
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