Epoxy Novolac Resin F-44 (High Temperature)

CAS 28064-14-4In StockSample available

Key Features

  • Highest Tg (180-220°C) in the epoxy novolac family
  • Functionality 4.0-5.5 for maximum cross-link density
  • Standard component in aerospace BMI/epoxy hybrid systems
  • Excellent hot/wet property retention
  • Power semiconductor encapsulation grade available

Epoxy Phenol Novolac Resin F-44 is a high-functionality epoxy derived from phenol-formaldehyde novolac with average functionality of 4.0-5.5 epoxide groups per molecule and EEW of 195-220 g/eq. The higher functionality versus F-51 and longer novolac backbone produce a resin system capable of achieving Tg values of 180-220°C, making it the premium epoxy novolac for extreme high-temperature structural composites, high-HDT electrical laminates, and high-temperature chemical process FRP.

F-44 is characterized by a semi-solid to solid consistency at ambient temperature (softening point 65-95°C) and is typically processed as a solution in solvents (MEK, DMF) or in blended systems with reactive diluents. The resin reacts with all standard epoxy curing agents (aromatic amines, anhydrides, DICY) and provides excellent chemical resistance in the cured state.

In aerospace composite applications, F-44 is the standard high-performance novolac component in BMI/epoxy hybrid systems and high-temperature prepreg formulations for jet engine nacelle structures, turbine blade shrouds, and other components requiring structural integrity above 200°C. The resin also serves as the basis for electronics-grade encapsulants for power semiconductors operating at junction temperatures above 150°C.

Specifications

ParameterValue
AppearanceAmber semi-solid to solid
Processing FormSolution in MEK/DMF or solid flakes
Softening Point65-95°C
Average Functionality4.0-5.5
Hydrolyzable Chloride≤500 ppm
Epoxy Equivalent Weight195-220 g/eq
Tg (DDS cured, 180°C+)180-220°C

Applications

Aerospace high-temperature prepreg (engine nacelles, >200°C)BMI/epoxy hybrid composite systemsHigh-HDT electrical laminate and multi-layer PCBPower semiconductor encapsulation (Tg >175°C)High-temperature corrosion-resistant FRP (>130°C service)

FAQ

Maximum Tg is achieved with 4,4'-DDS (diaminodiphenylsulfone): stoichiometric ratio 68-72 phr per 100g F-44 (using AHEW 62 g/eq, EEW ~207 midpoint). Cure schedule: 120°C/2h + 177°C/2h + 200°C/2h staged cure. This achieves Tg 200-220°C. For moderate Tg (170-185°C), DDM (4,4'-diaminodiphenylmethane) at 33-37 phr with 150°C/2h + 180°C/2h cure is simpler and more economical.

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