Fast-Cure Epoxy System (5-Minute Pot Life, Rapid Repair Grade)
Key Features
- 5-10 minute pot life for rapid assembly and repair
- 30-60 minute handling strength — minimal downtime
- Dual-cartridge dispensing for controlled mix ratio
- 15-25 MPa lap shear strength on metal and composite
- No heat required — ambient temperature cure
Fast-Cure Epoxy System is a two-part rapid-setting epoxy designed for applications requiring quick assembly, emergency repair, and time-critical bonding and casting operations. With a pot life of 5-10 minutes at 25°C and handling strength within 30-60 minutes, this system enables rapid structural repairs, on-site fixture bonding, and production assembly operations where cure speed is the primary constraint.
The system uses modified aliphatic polyamine hardener with high reactivity and low viscosity to achieve rapid crosslink formation without requiring heat. The 1:1 or 2:1 volume mix ratio enables use with standard dual-cartridge dispensing systems for controlled, mess-free application. Full cure is achieved within 24h at 23°C, developing tensile lap shear strength of 15-25 MPa on metal substrates.
Due to the fast cure chemistry, the system produces moderate Tg (40-60°C ambient cure) — suitable for room temperature and mild elevated temperature service but not for high-temperature applications. Heat post-cure at 60°C/1h increases Tg to 65-80°C. Typical applications include on-site concrete crack repair, rapid fixture bonding in assembly lines, emergency composite field repair, pipe and vessel patch repair kits, hobby and model bonding, and general industrial maintenance repair. Available in 25mL, 50mL, and 200mL dual-cartridge packs with mixing nozzles.
Specifications
| Parameter | Value |
|---|---|
| Pot Life (25°C) | 5-10 minutes |
| Full Cure (23°C) | 24 hours |
| Tg (ambient cure) | 40-60°C |
| Mix Ratio (volume) | 1:1 or 2:1 |
| Handling Time (25°C) | 30-60 minutes |
| Tg (60°C/1h post-cure) | 65-80°C |
| Tensile Lap Shear (Al, 24h) | 15-25 MPa |
Applications
FAQ
Tg is determined by cross-link density and chain mobility — higher cross-link density and more rigid monomers give higher Tg. Fast-cure epoxy systems use aliphatic polyamine hardeners (DETA, TETA, EDA adducts) which give fast reaction but low Tg (30-60°C ambient cure) because: (1) aliphatic amines have high flexibility in the cured network; (2) fast cure traps the network at lower conversion before chain mobility is frozen, resulting in lower actual cross-link density than theoretical. Slow-cure aromatic amine systems (DDS, DDM) require elevated temperature cure but achieve Tg 150-200°C because aromatic rings stiffen the network significantly. For applications requiring both fast cure and higher Tg, choose an accelerated heated cure (ambient gel + 80°C/2h post-cure) which drives conversion higher, pushing Tg to 80-100°C for aliphatic amine systems.
Direct Contact
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