Epoxy Adhesive Paste (High-Strength Structural, Thixotropic)

Epoxy Adhesive Paste is a two-part thixotropic structural adhesive based on BPA epoxy and amine or polyamide hardener, formulated for high-strength bonding of composite, metal, and substrate combinations in structural applications. The thixotropic rheology provides non-sag behavior on vertical and overhead surfaces (yield stress >500 Pa), enabling application at gap fills of 0.5-10mm without adhesive runoff during cure.

The adhesive provides tensile lap shear strength of 20-35 MPa on aluminum (ASTM D1002), steel, and CFRP substrates after cure at ambient temperature (23°C/24h) or elevated temperature (60°C/2h for faster processing). Tg of the cured adhesive layer is 60-80°C (ambient cure) or 80-100°C (elevated cure), suitable for structural bonding in transportation, construction, and industrial applications.

Formulated with silica and calcium carbonate fillers for thixotropy and reduced shrinkage (<1%), the paste adhesive offers excellent gap-filling capability and tolerates bonding of substrates with machining tolerances. Core applications include structural bonding of composite and metal sandwich panels, boat hull-to-deck bonding, carbon fiber tube-to-metal end fitting bonding, honeycomb core repair, and structural bonding in rail and bus body construction. Available in 400mL cartridge, 1L, and 5L packaging with static mixer tips for one-to-one or 2:1 by volume mix ratios.