Bisphenol A Solid Epoxy Resin (EEW 450-500)

Bisphenol A Solid Epoxy Resin (Grade 1001, EEW 450-500 g/eq) is a medium-molecular-weight solid epoxy resin equivalent to DER 661, Araldite GT 6071, and Epikote 1001. The higher degree of polymerization (n≈2) produces a pale yellow to tan solid with softening point 64-76°C (Durran ball-and-ring method). The increased molecular weight provides excellent flexibility in coatings, improved impact resistance, and enhanced compatibility with polyamides and other flexibilizing co-resins.

This grade is widely used in powder coatings (as the solid binder combined with polyester or other curing agents), protective coatings dissolved in suitable solvents, and as a flexibilizing modifier blended with lower EEW liquid epoxies. In powder coatings, particle size is <100 µm and the resin is ground with the hardener to produce a free-flowing powder.

Epoxy equivalent weight of 450-500 g/eq requires adjustment of hardener stoichiometry relative to liquid grades. With DICY (dicyandiamide), powder coating formulations cure at 175-190°C in 10-20 minutes. Chemical resistance of cured coatings is excellent for corrosion protection of steel, aluminum, and concrete infrastructure.