Bisphenol A Liquid Epoxy Resin (EEW 176-186)
Key Features
- Higher epoxy content (lower EEW) than standard BPA-128
- Lower viscosity for easier processing
- Tighter hydrolyzable chloride spec for electronic applications
- Higher cross-link density — improved Tg and mechanical properties
- Excellent color — suitable for optical and transparent applications
Bisphenol A Liquid Epoxy Resin (EEW 176-186 g/eq) is a high-purity, tightly controlled liquid epoxy resin with slightly higher epoxy content and lower viscosity than the standard EEW 184-194 grade. Equivalent to commercial designations DER 330, Araldite GY 260, and Epikote 828EL, this grade provides a higher density of reactive sites per gram, resulting in higher cross-link density, improved Tg, and enhanced mechanical properties in demanding composite and adhesive applications.
The lower EEW of 176-186 g/eq is achieved through optimized BPA/ECH ratio and reaction conditions in synthesis, producing fewer high-molecular-weight oligomers and more diglycidyl ether of bisphenol A monomer. Viscosity at 25°C is 8,000-12,000 mPa·s, lower than the -128 grade, aiding processing in lamination and adhesive applications.
Hydrolyzable chloride ≤350 ppm (tighter than standard grade) makes it suitable for sensitive electronic applications. Cured with stoichiometric IPDA (isophorone diamine), Tg is 140-160°C. Key applications include high-performance composite prepregs, carbon fiber adhesive systems, electrical potting compounds, and specialty structural adhesives where maximum cross-link density is required.
Specifications
| Parameter | Value |
|---|---|
| Appearance | Clear to very slightly yellow liquid |
| Epoxy Value | 0.54-0.57 eq/100g |
| Color (Gardner) | ≤1 |
| Density (25°C) | 1.16-1.17 g/cm³ |
| Viscosity (25°C) | 8,000-12,000 mPa·s |
| Hydrolyzable Chloride | ≤350 ppm |
| Epoxy Equivalent Weight | 176-186 g/eq |
Applications
FAQ
IPDA (isophorone diamine, CAS 2855-13-2) has AHEW of 42.6 g/eq. For EEW 181 g/eq (midpoint): stoichiometric ratio = 42.6/181 × 100 = 23.5 phr per 100g resin. Typical use range: 22-26 phr. IPDA gives pot life of 45-90 min at 25°C (200g mix). Cure schedule: 24h at RT + 1h at 80°C for structural laminates. IPDA provides better UV stability than aliphatic polyamines but slower cure than TETA/DETA.
Direct Contact
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