Adipic Dihydrazide (ADH)

CAS 1071-93-8In StockSample available

Key Features

  • Excellent latency at ambient — weeks to months in epoxy dispersions
  • High water solubility enables waterborne epoxy formulations
  • Flexible and tough cured systems vs. conventional amine curatives
  • Relatively low toxicity vs. aromatic amines and isocyanates
  • Compatible with aqueous epoxy dispersions for 1K waterborne systems

Adipic Dihydrazide (ADH) is a bifunctional latent curing agent for epoxy resins, providing excellent latency at ambient temperature with activation above 120°C. ADH contains two active hydrazide groups (–NH–NH2) per molecule, each capable of ring-opening epoxy groups, with an equivalent weight of approximately 87 g/eq (based on –NH2 groups). ADH produces epoxy cured systems with notably high flexibility and toughness compared to amine-cured counterparts at similar crosslink density, because the hydrazone linkages formed during cure are inherently more flexible than conventional amine-epoxy bonds. ADH is particularly useful in waterborne epoxy systems, where its water solubility allows formulation of stable 1K or 2K aqueous systems without phase separation. It is also used in one-component adhesives and coatings where room-temperature latency is combined with moderate-temperature cure (120–150°C). Dosage is approximately 10–15 phr for standard BPA epoxy. ADH is a white, water-soluble powder with good stability at ambient conditions. Unlike aromatic amines or isocyanates, ADH has a relatively favorable toxicological profile, with no carcinogen classification, making it preferred in applications requiring lower occupational hazard risk.

Specifications

ParameterValue
Purity≥98%
AppearanceWhite crystalline powder
Shelf Life24 months in sealed container
Melting Point178–183°C
Water Solubility (20°C)>100 g/L (highly soluble)
Active Hydrogen Equivalent Weight~87 g/eq

Applications

Waterborne 1K and 2K epoxy adhesive and coating systemsFlexible latent epoxy adhesive films and tapesOne-component moisture-barrier epoxy coatingsToughened epoxy casting systems requiring moderate cure temperatureLatent hardener in epoxy powder coatings requiring flexibility

FAQ

Both provide ambient-temperature latency with heat-activated cure, but differ in key properties: ADH produces more flexible, tougher cured systems than DICY; ADH is water-soluble (enabling waterborne formulations), while DICY has limited water solubility; ADH has a lower activation temperature (can cure at 100–120°C), while DICY typically requires 120–150°C. ADH is preferred for waterborne and flexible applications; DICY for dry, rigid, high-performance structural epoxy.

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