Epoxy Novolac Vinyl Ester Resin (High Temp)
Key Features
- HDT 140-175°C for high-temperature chemical service
- Superior chemical resistance — including concentrated acids at 50°C
- High cross-link density from multifunctional novolac backbone
- Peroxide/amine cure like standard VER — easy fabrication
- Validated for sulfuric acid FGD and petrochemical service
Epoxy Novolac Vinyl Ester Resin is produced by reacting epoxy novolac resin (a multi-functional phenol-formaldehyde-based epoxy with functionality 3-6) with methacrylic acid, creating a highly cross-linked vinyl ester network with significantly higher thermal performance and chemical resistance than standard bisphenol A vinyl ester grades.
The high functionality of the novolac backbone increases cross-link density, raising HDT to 140-175°C (post-cured) versus 90-110°C for standard BPA vinyl ester. This makes it the vinyl ester of choice for elevated-temperature chemical service where standard grades soften and lose structural integrity. Chemical resistance is expanded to concentrated sulfuric acid at 50°C, fuming acids, and aggressive organic chemicals.
Viscosity at 25°C is 400-800 mPa·s. Cure is by MEKP/cobalt for ambient cure or BPO/DMPT for accelerated cure. Post-cure at 130-150°C for 2-4 hours is required to fully develop the elevated temperature properties. Applications include high-temperature chemical reactors, sulfuric acid service tanks, FRP flue gas desulfurization (FGD) systems, and process piping in petrochemical plants.
Specifications
| Parameter | Value |
|---|---|
| Appearance | Pale yellow to amber liquid |
| Resin Type | Epoxy novolac vinyl ester |
| Functionality | 3-6 methacrylate end groups |
| Styrene Content | 35-45% |
| Viscosity (25°C) | 400-800 mPa·s |
| HDT (post-cured 150°C/2h) | 140-175°C |
| Gel Time (25°C, 1.5% MEKP) | 15-25 min |
Applications
FAQ
A staged post-cure is recommended: (1) Room temperature cure for 24-48 hours; (2) Ramp to 80°C at 2°C/min, hold 2 hours; (3) Ramp to 130°C at 2°C/min, hold 2 hours; (4) Ramp to 150°C at 1°C/min, hold 2 hours; (5) Cool at 1°C/min to room temperature. Skipping the staged ramp and jumping directly to 150°C can cause thermal stress cracking in thick laminates. Minimum post-cure for acceptable chemical resistance (80-100°C service) is 80°C/4h.
Direct Contact
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