Mono-Epoxy Reactive Diluent (2-Ethylhexyl Glycidyl Ether)
Key Features
- Ultra-low viscosity (5-10 mPa·s) for maximum viscosity reduction
- Low vapor pressure — reduced worker exposure vs. volatile solvents
- Lower skin sensitization risk than aromatic glycidyl ethers
- Fully reactive — does not reduce final film crosslink density as much as solvents
- Miscible with all standard liquid epoxy resins in all proportions
2-Ethylhexyl Glycidyl Ether (EHGE, CAS 2461-15-6) is a mono-functional reactive diluent for epoxy resin systems. With a very low viscosity of 5-10 mPa·s at 25°C and EEW of 215-230 g/eq, EHGE is the most widely used aliphatic glycidyl ether reactive diluent for reducing the viscosity of BPA and BPF epoxy systems without introducing non-reactive solvents that would compromise film properties.
Addition of EHGE at 10-20 phr per 100g base epoxy reduces the system viscosity by 40-70%, enabling high-solids (>80%) and solventless coating formulations, no-mix floor coating systems, and wet-on-wet coating processes at ambient temperature. The mono-functional nature means each EHGE molecule acts as a chain terminator in the crosslinked network, which reduces Tg and chemical resistance proportionally to loading — therefore careful optimization is required to balance viscosity reduction against property compromise.
EHGE is miscible with all standard liquid epoxy resins (BPA, BPF) in all proportions and is compatible with amine (aliphatic, cycloaliphatic, aromatic), anhydride, and DICY curing agents. Vapor pressure is low (0.02 mPa at 20°C) and skin sensitization risk is significantly lower than phenyl glycidyl ether, making it the preferred reactive diluent from a health and safety standpoint for worker-exposed industrial coating applications.
Specifications
| Parameter | Value |
|---|---|
| Appearance | Water-white clear liquid |
| Flash Point | >100°C |
| Color (APHA) | ≤20 |
| Viscosity (25°C) | 5-10 mPa·s |
| Hydrolyzable Chloride | ≤500 ppm |
| Vapor Pressure (20°C) | ~0.02 mPa |
| Epoxy Equivalent Weight | 215-230 g/eq |
Applications
FAQ
EHGE at 10 phr per 100g BPA epoxy (EEW 189) reduces Tg by approximately 10-15°C when cured with cycloaliphatic amine (IPDA) at ambient temperature. At 20 phr, Tg reduction is approximately 20-30°C. For chemical-resistant industrial coatings where Tg >60°C is required for hot solvent service, limit EHGE to ≤15 phr. For non-chemical-service floor coatings, up to 20-25 phr is acceptable. The mono-functional chain termination effect is compounded by incomplete cure if the EHGE/hardener stoichiometry is not adjusted — always calculate hardener loading on the weighted average EEW of the blend.
Direct Contact
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