NE-glass / L-glass Roving (High-Frequency)
Key Features
- Low-Dk glass chemistry — Dk 4.0–4.4, Df 0.003–0.004 at 10 GHz
- Fine filament 5.5–7 μm enables thin PCB cloth weaving (Style 1080 and lighter)
- Alkali <1% preserves dielectric performance under humid PCB service
- PCB-grade silane sizing for downstream weaving and resin impregnation
- Drop-in replacement for imported NE-glass / L-glass yarn in low-Dk CCL supply chains
NE-glass / L-glass High-Frequency Roving is a low-Dk continuous glass fiber yarn engineered as the feedstock for electronic-grade PCB cloth weaving — particularly low-Dk styles 1080, 2116 and 7628 used in 5G base station and millimeter-wave radar laminates. NE-glass (Nippon Electric Glass) and L-glass (Hitachi Chemical lineage) belong to the same generation of low-Dk glass families, distinct from standard E-glass by reduced alkali, boron and calcium content that lowers the dielectric constant of the bulk glass.
Linear density is offered in 1200 tex and 2400 tex options with filament diameter 5.5–7 μm, optimized for fine-yarn weaving of thin PCB cloths. Dielectric performance measured on a representative woven and resin-impregnated panel is Dk 4.0–4.4 and Df 0.0030–0.0040 at 10 GHz. Alkali (Na₂O + K₂O) content is held below 1% to preserve dielectric stability under humidity. The sizing is silane-based and tuned for downstream weaving and PCB fabric impregnation with epoxy, PI and PPE/PPO resins.
Specifications
| Parameter | Value |
|---|---|
| Sizing | Silane, epoxy/PI/PPE-compatible (PCB-grade) |
| Package | 10–18 kg cylindrical doff, single end |
| Glass Type | NE-glass / L-glass (low-Dk family) |
| Df @ 10 GHz | 0.0030–0.0040 |
| Dk @ 10 GHz | 4.0–4.4 |
| Linear Density | 1200 tex / 2400 tex (±5%) |
| Moisture Content | ≤0.1% |
| Filament Diameter | 5.5–7 μm |
| Ignition Loss (LOI) | 0.4–0.7% |
| Alkali Content (Na₂O + K₂O) | <1% |
Applications
FAQ
Both NE-glass and L-glass are low-Dk glass families developed for high-frequency PCB cloth — NE-glass is the Nippon Electric Glass family, L-glass originates from the Hitachi Chemical lineage. The two have slightly different oxide ratios but target the same dielectric envelope: Dk roughly 4.0–4.4 and Df roughly 0.003–0.004 at 10 GHz. For procurement on standard cloth styles like 2116, they are functionally interchangeable — the CCL recipe is qualified to the cloth dielectric and weave geometry rather than to the specific glass house. For Df-critical mmWave classes (e.g. very low-loss 28 GHz substrates), validate the chosen yarn against the CCL specification with a small lamination trial.
Direct Contact
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