Low-Dk Glass Fabric Style 1080 (5G PCB)

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Key Features

  • Low Dk 4.0–4.4 and low Df 0.003–0.004 at 10 GHz for mmWave impedance control
  • Thin 63 μm build ideal for outer signal layers and HDI build-up
  • Compatible with epoxy, PI and PPE/PPO low-loss CCL systems
  • Style 1080 per IPC-EG-140 — drop-in for 5G base station and 77 GHz radar stack-ups
  • Consistent thread count supports tight controlled-impedance lithography

Low-Dk Glass Fabric Style 1080 is a thin electronic-grade glass cloth woven from D-glass or NE-glass yarn (filament diameter 5.5–7 μm) to IPC-EG-140 Style 1080. Areal weight is approximately 47 g/m² at a thread count of 60×47 ends per inch (warp × weft) and a cured thickness of roughly 63 μm, making it the standard prepreg cloth for outer signal layers in high-frequency PCBs. Standard width is 1270 mm.

The defining property is dielectric performance: dielectric constant (Dk) at 10 GHz sits in the 4.0–4.4 range and loss tangent (Df) at 10 GHz in the 0.0030–0.0040 range, well below E-glass (Dk ~6.1, Df ~0.006) and tuned for millimeter-wave impedance control and low insertion loss. Silane sizing is compatible with epoxy, PI and PPE/PPO resin systems used in low-loss CCL manufacturing. The thin build supports tight HDI line/space and controlled-impedance stripline geometry in 5G base station and automotive radar boards.

Specifications

ParameterValue
SizingSilane, epoxy/PI/PPE-compatible
IPC Style1080 per IPC-EG-140
Yarn TypeD-glass / NE-glass
Df @ 10 GHz0.0030–0.0040
Dk @ 10 GHz4.0–4.4
Areal Weight~47 g/m²
Standard Width1270 mm
Cured Thickness~63 μm
Filament Diameter5.5–7 μm
Thread Count (warp × weft)60 × 47 ends/inch

Applications

5G base station PCB outer signal layersMillimeter-wave radar PCB substratesAutomotive 77 GHz radar laminatesHigh-density interconnect (HDI) outer build-up layersmmWave antenna and antenna-in-package (AiP) laminate

FAQ

Style 1080 is the thin cloth (~47 g/m², ~63 μm) used for outer signal layers and HDI build-up where line width is small and impedance tolerance is tight. Style 2116 is roughly twice as thick (~104 g/m², ~104 μm) and is used for inner dielectric layers and rigid cores where mechanical stability and a thicker dielectric for power/ground planes matter more than line density. A typical 5G mmWave board mixes both: 1080 prepreg on the outer signal/antenna layers, 2116 prepreg or core in the middle to set the overall board thickness and stiffness.

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