Low-Dk Glass Fabric Style 2116 (5G PCB)
Key Features
- Low Dk 4.0–4.4 and low Df 0.003–0.004 at 10 GHz — same dielectric class as Style 1080
- 104 μm build ideal for inner dielectric cores and impedance-stable power/ground planes
- Dimensional stability under multilayer lamination thermal cycles
- Compatible with epoxy, PI and PPE/PPO low-loss CCL systems
- IPC-EG-140 Style 2116 — qualified for 5G mmWave and satcom PCB stack-ups
Low-Dk Glass Fabric Style 2116 is the workhorse mid-thickness electronic-grade cloth for high-frequency PCB inner dielectric and core layers, woven from D-glass or NE-glass yarn (filament diameter 5.5–7 μm) to IPC-EG-140 Style 2116. Areal weight is approximately 104 g/m² at a thread count of 60×58 ends per inch (warp × weft) and a cured thickness of roughly 104 μm — about twice the build of Style 1080 — at a standard width of 1270 mm.
Dielectric performance matches the 1080 grade: Dk 4.0–4.4 at 10 GHz and Df 0.0030–0.0040 at 10 GHz, low enough for 5G mmWave impedance control and low insertion loss in long inner-layer traces. The same silane sizing is compatible with epoxy, PI and PPE/PPO low-loss resin systems. In a typical 5G multilayer board, 2116 is selected for inner power and signal cores because its greater dielectric thickness improves layer-to-layer registration, dimensional stability under thermal cycling and ease of impedance targeting on wider inner-layer traces.
Specifications
| Parameter | Value |
|---|---|
| Sizing | Silane, epoxy/PI/PPE-compatible |
| IPC Style | 2116 per IPC-EG-140 |
| Yarn Type | D-glass / NE-glass |
| Df @ 10 GHz | 0.0030–0.0040 |
| Dk @ 10 GHz | 4.0–4.4 |
| Areal Weight | ~104 g/m² |
| Standard Width | 1270 mm |
| Cured Thickness | ~104 μm |
| Filament Diameter | 5.5–7 μm |
| Thread Count (warp × weft) | 60 × 58 ends/inch |
Applications
FAQ
Inner cores in a multilayer high-frequency board carry power, ground and slower signals where the dielectric thickness directly sets layer-to-layer impedance, controls crosstalk between adjacent signal planes, and provides mechanical stability during pressing. At ~104 μm cured thickness, Style 2116 gives enough dielectric build to target 50 Ω and 100 Ω differential impedance comfortably on typical inner-layer trace widths, while remaining thin enough to keep total board thickness within standard 5G base station card cages. Style 1080 is too thin for inner cores; heavier styles like 7628 are used only when total stack-up demands extra rigidity.
Direct Contact
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