Hexahydrophthalic Anhydride (HHPA)

CAS 85-42-7In StockSample available

Key Features

  • Solid form for easy weighing and dry-mix applications
  • Fully saturated structure for UV stability and low yellowing
  • Excellent electrical properties and low ionic impurity
  • Compatible with liquid anhydride blending for viscosity control
  • High purity grade available for electronic applications

Hexahydrophthalic Anhydride (HHPA) is a fully saturated cycloaliphatic anhydride curing agent for epoxy resins, offering a unique combination of solid form at room temperature (melting point 34–36°C), high purity, and excellent electrical and mechanical properties in cured systems. Unlike the liquid MTHPA and MHHPA, HHPA is handled as a solid or low-melting-point liquid above 40°C, requiring heated mixing lines for large-scale production. Its anhydride equivalent weight (AEW) is approximately 154 g/eq, slightly lower than MTHPA. HHPA produces cured epoxy systems with very high Tg (100–140°C with post-cure), excellent electrical insulation properties, low ionic impurity, and good chemical resistance. It is used in epoxy glass fiber laminate systems (B-staged prepregs), electrical casting compounds where slow pour is required, and dry powder pre-mix systems for automated injection or transfer molding of epoxy. HHPA can also be blended with liquid anhydrides (MTHPA or DDSA) to adjust viscosity, pot life, and flexibility of the cured product. Accelerators (BDMA, DMP-30, or imidazoles) are required at 0.5–2% dosage.

Specifications

ParameterValue
Purity≥98%
Acid Value720–740 mg KOH/g
AppearanceWhite to off-white solid
Shelf Life24 months in sealed container
Melting Point34–36°C
Anhydride Equivalent Weight (AEW)~154 g/eq

Applications

B-staged epoxy glass fiber prepreg for laminate productionDry powder epoxy transfer molding compound systemsHigh-performance electrical casting compoundsBlending with liquid anhydrides for viscosity adjustmentHigh-purity electronic potting with stringent ionic requirements

FAQ

HHPA's melting point (34–36°C) is just above ambient temperature, allowing it to be melted by warming the epoxy resin to 40–50°C. The solid HHPA is then added to the warm epoxy and stirred until fully dissolved. The resulting blend is poured or transferred at elevated temperature. For production scale, heated mixing tanks and heated transfer lines are required to maintain fluidity during processing.

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