Silicone Potting Compound for Drone ESC and Flight Controller
A two-component addition-cure silicone potting compound for complete encapsulation of drone electronic speed controllers (ESC), flight controllers (FC), and power management modules requiring IP67 waterproofing, thermal stability, and vibration isolation in a single-material solution.
Key Features
- ✓Addition cure with no by-products — no shrinkage stress on MEMS sensors, crystals, and bare die FC components
- ✓Thermal conductivity 0.8–1.5 W/m·K — extracts ESC FET heat to airframe rather than relying on convection alone
- ✓IP67 sealing capability (1m / 30 min) when applied at full coverage around ESC and FC assemblies
- ✓Service range -60°C to +200°C — stable from high-altitude cold soak to continuous motor heat exposure
- ✓Shore A 30–50A — soft elastic cured compound provides vibration damping for flight controller components
- ✓Volume resistivity >10¹⁴ Ω·cm — complete electrical isolation of all enclosed conductors and solder joints
Specifications
| Parameter | Value |
|---|---|
| Cure type | Addition cure, platinum-catalyzed (no by-products) |
| Full cure (25°C) | 24 h |
| Full cure (65°C) | 2 h |
| Volume resistivity | >10¹⁴ Ω·cm |
| Working time (25°C) | 30–60 min |
| Mixed viscosity (25°C) | 500–2,000 mPa·s |
| Shore A hardness (cured) | 30–50A |
| Mix ratio (A:B by weight) | 1:1 |
| Service temperature range | -60°C to +200°C |
| IP rating (potted assembly) | IP67 (1m / 30 min) |
| Thermal conductivity (cured) | 0.8–1.5 W/m·K |
FAQ
MEMS sensors (accelerometers, gyroscopes, barometric pressure sensors) require specific potting precautions: (1) Barometric pressure sensors (baro altimeters) must NOT be potted — they require atmospheric pressure access and will give constant false altitude readings if potted; protect these with a separate breathable Gore-Tex membrane vent or a selectively coated conformal coating approach. (2) MEMS gyros and accelerometers can be potted but the cured compound Shore A must be ≤50A (soft) to avoid coupling sensor package thermal stress to the die — hard potting with epoxy directly onto gyros causes calibration drift. (3) Crystal oscillators are sensitive to stress — ensure pour height above the crystal case does not exceed 3 mm per cure cycle to prevent thermal expansion stress during cure at 65°C.