Bismaleimide Resin Solution (BMI/DDM in MEK, Prepreg Grade)
Key Features
- Pre-blended BMI/DDM at precise ratio — eliminates customer mixing error
- Ready-to-use for solution-dip fiber impregnation
- Tack and drape similar to 177°C epoxy prepreg after B-staging
- 3-6 months cold storage stability (-18°C)
- Tg 280-320°C with standard BMI cure + 230°C post-cure
Bismaleimide Resin Solution is a pre-formulated blend of BMI monomer and DDM co-reactant dissolved in methyl ethyl ketone (MEK) or N-methylpyrrolidone (NMP) solvent at 40-60% solids content. This ready-to-use solution eliminates the need for customers to blend BMI and DDM at precise ratios and is optimized for direct prepreg impregnation by hot-melt or solvent-dip/drum winding processes.
The BMI/DDM ratio is precisely controlled at 100:30-35 (by weight) in the solution to provide the balance of toughness, Tg, and processability established in the classic BMI/DDM system. The solution remains stable for 3-6 months at -18°C cold storage, enabling pre-formulation inventory management. Viscosity at 25°C is 500-2,000 mPa·s in solvent — suitable for direct fiber impregnation via solution bath for woven fabrics and unidirectional tapes.
After solvent evaporation, the resulting B-staged BMI/DDM prepreg has tack and drape characteristics comparable to 177°C epoxy prepregs, enabling manual and automated lay-up of structural aerospace composite parts. The cure schedule follows the standard BMI/DDM protocol: 150°C gel + 177°C/2h + 230°C/4h post-cure. Applications include aerospace structural prepreg for engine nacelles, hot-zone composite control surfaces, military aircraft composite structures, and composite tooling prepregs for 230°C post-cure tooling applications.
Specifications
| Parameter | Value |
|---|---|
| Solvent | MEK or NMP |
| Solids Content | 40-60 wt% |
| Viscosity (25°C) | 500-2,000 mPa·s |
| Tg (177°C cure only) | 250-270°C |
| BMI/DDM Ratio (by weight) | 100:30-35 |
| Storage Stability (-18°C) | 3-6 months |
| Tg (cured + 230°C post-cure) | 280-320°C |
Applications
FAQ
MEK (methyl ethyl ketone, bp 79°C): lower boiling point, fast evaporation at room temperature and mild heating, lower toxicity (TWA 200 ppm OEL), preferred for prepreg where rapid solvent removal during drum winding is required. NMP (N-methylpyrrolidone, bp 202°C): higher boiling point, requires >100°C drying to remove, higher toxicity profile (SVHC under REACH — reproductive toxicant Category 1B, TWA 10 ppm OEL), better solvating power for high-solids formulations. MEK-based solutions are preferred for standard prepreg manufacturing. NMP-based solutions are used for high-solids (>60%) casting and very thick prepreg where MEK evaporation rate would be excessive. NMP-based solutions also provide better wet-out in RTM applications where the solution is injected rather than used as a bath.
Direct Contact
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