Phenolic Novolac Resin Powder (Hexamine-Hardened)

CAS 9003-35-4In StockSample available

Key Features

  • Thermoplastic at room temperature — stable 12-24 month shelf life
  • HDT >200°C in glass-filled compounds for high-temperature service
  • UL94 V-0 inherent flame retardancy at 1.6mm
  • Standard resin for phenolic compression and transfer molding
  • Excellent thermal dimensional stability for precision molded parts

Phenolic Novolac Resin Powder is a thermoplastic (uncured) phenol-formaldehyde resin produced under acid-catalyzed conditions with excess phenol relative to formaldehyde (F/P molar ratio 0.75-0.85), resulting in a linear oligomeric structure without methylol groups. The resin is solid at room temperature (softening point 80-110°C, Durran method) and requires a separate hardener — hexamethylenetetramine (hexamine, HMTA) at 10-15 phr — to crosslink and cure at 150-180°C via methylene bridge formation.

Phenolic novolac powder is the primary molding compound resin for phenolic compression molding, transfer molding, and injection molding of thermoset parts. Blended with mineral or glass fiber reinforcement, the compound produces rigid, dimensionally stable parts with excellent heat resistance (HDT >200°C under 1.82 MPa), dimensional stability under thermal and mechanical loading, and inherent flame retardancy (UL94 V-0 at 1.6mm).

Applications include phenolic molding compounds for electrical components (switches, circuit breakers, connectors), automotive brake pads (friction compounds), phenolic refractory binder for industrial furnace applications, baked carbon and graphite electrode binder, and abrasive grain bonding for grinding wheels (vitrified and resin-bonded). Novolac resins offer 12-24 month shelf life at ambient temperature versus the limited shelf life of resole resins under refrigerated storage.

Specifications

ParameterValue
AppearanceTan to amber powder or flake
Free Phenol<1.5%
FlammabilityUL94 V-0 at 1.6mm
Shelf Life (ambient)12-24 months
Softening Point (Durran)80-110°C
HDT (glass-filled compound)>200°C
Hexamine Content (in compound)10-15 phr

Applications

Phenolic thermoset molding compounds for electrical componentsAutomotive brake pad and friction material binderAbrasive grinding wheel bonding (resin-bonded wheels)Baked carbon and graphite electrode binderRefractory and foundry sand binder

FAQ

Novolac (acid-catalyzed, F/P <1): linear thermoplastic oligomer, phenol-excess, no methylol groups, requires hexamine hardener for cure, stable at ambient temperature for 1-2 years, solid at room temperature. Resole (base-catalyzed, F/P >1): branched methylol-containing thermosetting oligomer, formaldehyde-excess, self-cures on heating >120°C, requires refrigerated storage (6-12 months), typically liquid. Both cure via methylene bridge crosslinking but through different mechanisms: novolac uses hexamine as methylene donor at 150-180°C; resole undergoes direct methylol condensation at 120-180°C. Cured properties are similar (LOI >65%, HDT >200°C), though resole tends to have higher void content due to water release during cure and requires higher molding pressure.

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