Phlogopite Mica (Heat Resistant, d50 100µm)
Key Features
- Maximum thermal stability to 1000°C — outperforms muscovite in high-temperature use
- Excellent electrical insulation for Class H (180°C) insulation systems
- High aspect ratio (>25:1) for effective moisture and gas barrier
- Key ingredient in certified fire-resistant composite building panels
- Thermal interface material combining insulation and in-plane thermal conductivity
Phlogopite mica is a magnesium-rich phyllosilicate mineral (KMg₃(AlSi₃)O₁₀(OH)₂) that offers superior thermal stability compared to muscovite mica, with a service temperature up to 1000°C. The golden-brown colored platelets have aspect ratios typically exceeding 25:1, providing excellent barrier, reinforcing, and thermal insulation properties in demanding high-temperature composite applications.
Phlogopite's thermal stability arises from the magnesium-iron substitution in its octahedral layer, which is more resistant to dehydroxylation than the aluminum-dominant muscovite structure. This makes phlogopite the preferred mica variety for high-temperature electrical insulation (class H and C insulation systems), fireproof composites, and refractory applications where muscovite would undergo structural degradation.
In the composites industry, phlogopite mica is used in high-temperature resistant epoxy and phenolic composites for aerospace and automotive thermal management applications. Its combination of electrical insulation (dielectric strength >500 V/mil) and thermal conductivity (1–3 W/m·K through the platelets) makes it valuable in thermal interface materials. Phlogopite mica paper and tape are used as class H winding insulation in motors and transformers. It is also a key ingredient in fire-resistant composite building panels certified to fire resistance standards.
Specifications
| Parameter | Value |
|---|---|
| Appearance | Golden brown flakes |
| Aspect ratio | >25:1 (lamellar platelet) |
| Mohs hardness | 2.5–3.0 |
| Phlogopite content | ≥ 93% |
| Dielectric strength | >500 V/mil |
| Bulk density (tapped) | 0.2–0.4 g/cm³ |
| Loss on ignition (1000°C) | 3.0–4.5% |
| Median particle size (d50) | 100 µm |
| Maximum service temperature | 1000°C |
Applications
FAQ
The composite's practical temperature limit is set by the epoxy resin matrix, not the mica. Standard bisphenol-A epoxy has Tg ~120–140°C; high-temperature epoxy systems can reach Tg 180–220°C. The mica filler itself is stable to 1000°C. For applications requiring composite stability beyond the epoxy matrix limit, phenolic or BMI resin systems combined with phlogopite mica are preferred, providing continuous service above 250°C.
Direct Contact
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