Solid Glass Microspheres (d50 35µm)
Key Features
- Perfect sphere geometry reduces compound viscosity at equal volume fraction
- Isotropic particle shape minimizes warpage and shrinkage anisotropy
- Anti-slip function in gelcoat and floor coatings without sharp silica edges
- Excellent precision spacer for bond line thickness control in adhesives
- High compressive strength (>70,000 psi) — survives all thermoset processing conditions
Solid glass microspheres are perfectly spherical, solid borosilicate glass beads with a median particle size of approximately 35 µm and a true density of 2.45–2.50 g/cc. Unlike hollow microspheres used for weight reduction, solid glass microspheres are primarily valued for their spherical geometry, which imparts distinctive processing and performance benefits in filled composite systems.
The perfect spherical shape of solid glass beads acts as a ball bearing in resin systems, reducing compound viscosity compared to angular or irregular fillers at equal volume fraction. This makes them particularly useful in high-solids casting and coating formulations where processability must be maintained at high filler loadings. The isotropic particle geometry also minimizes warpage and shrinkage anisotropy in molded parts, a significant advantage in precision SMC and injection-molded composites.
Solid glass microspheres contribute to improved abrasion resistance, compressive strength, and dimensional stability in the cured composite. In gelcoat and topcoat applications, they provide a distinctive 'sand-in-glass' texture that improves grip without the sharp edges of crystalline silica sand. They are also used as spacers to control bond line thickness in structural adhesives and as isotropic reinforcement in dimensional-stability-critical applications like printed circuit board laminates.
Specifications
| Parameter | Value |
|---|---|
| True density | 2.45–2.50 g/cc |
| Particle type | Solid borosilicate glass sphere |
| Moisture content | ≤ 0.2% |
| Particle size range | 10–90 µm |
| Chemical composition | Borosilicate glass |
| Compressive strength | ≥ 70,000 psi |
| Roundness (circularity) | ≥ 0.90 |
| Median particle size (d50) | 35 µm |
Applications
FAQ
Yes. Solid glass microspheres with d50 ~35 µm can control minimum bond line thickness at 35–50 µm when used at 0.5–2% in epoxy structural adhesives. The high compressive strength (>70,000 psi) ensures spheres do not deform under clamping pressure. For thicker bond lines, select larger median diameter grades. Narrow particle size distribution is important for consistent spacer performance.
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